Qualcomm Snapdragon X2 Plus (X2P 42 100) vs HiSilicon Kirin 9000S
SOC · Specs Compare
General Parameters
Release Date
Jan 2026
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Manufacturer
Qualcomm
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Type
Laptop
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Instruction Set
ARMv9
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Core Architecture
Snapdragon X
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Processor Number
X2P-42-100
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Integrated Graphics
Qualcomm Adreno X1-45
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Package
Manufacturing Process
3 nm
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Socket
Custom
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Power Consumption
10 W
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Max Turbo Power Consumption
22 W
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CPU Performance
Performance Cores
6
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Performance Core Threads
6
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Performance Core Base Frequency
3.4 GHz
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Performance Core Turbo Frequency
4.04 GHz
—
Total Core Count
6
—
Total Thread Count
6
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Multiplier
34
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Unlocked Multiplier
No
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Memory Parameters
Memory Types
LPDDR5X-9523
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Max Memory Bandwidth
152 GB/s
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ECC Memory Support
No
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Graphics Card Parameters
Integrated Graphics
true
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GPU Base Frequency
280 MHz
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GPU Max Dynamic Frequency
910 MHz
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Shader Units
768
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Texture Units
48
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Raster Operation Units
24
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Execution Units
3
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Miscellaneous
CPU
Architecture
—
1x 2.62 GHz – TaiShan V1203x 2.15 GHz – TaiShan V1204x 1.53 GHz – Cortex-A510
Frequency
—
2620 MHz
Cores
—
8
Instruction set
—
ARMv8-A
Process
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7 nm
TDP
—
7 W
Manufacturing
—
SMIC
Graphics
GPU name
—
Maleoon 910
GPU frequency
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750 MHz
Memory
Memory Type
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LPDDR5
Memory frequency
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2750 MHz
Bus
—
4x 16 Bit
Max bandwidth
—
44 Gbit/s
Multimedia (ISP)
Neural processor (NPU)
—
Yes
Storage type
—
UFS 3.1, UFS 4.0
Max display resolution
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3840 x 2160
Video capture
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4K at 60FPS
Video playback
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4K at 60FPS
Video codecs
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H.264, H.265, VP9
Audio codecs
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AAC, AIFF, CAF, MP3, MP4, WAV
Connectivity
4G support
—
LTE Cat. 24
5G support
—
Yes
Download speed
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Up to 4600 Mbps
Upload speed
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Up to 2500 Mbps
Wi-Fi
—
6
Bluetooth
—
5.2
Navigation
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GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Info
Announced
—
Aug 2023
Class
—
Flagship
Model number
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Hi36A0
Benchmark
Geekbench 6
3,239
1,334
Geekbench 6
11,952
4,128
Cinebench 2024
119
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Cinebench 2024
752
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AnTuTu 10
—
903,932
▲ Specs Compare
Data sourced from official specifications and benchmark tests.