HiSilicon Kirin 9000
The HiSilicon Kirin 9000 is a SOC manufactured by , built on 's officially announced AI accelerator process technology. This processor features a 8-core architecture design. The Thermal Design Power (TDP) is rated at 6 W. Overall specifications are targeted at mainstream high-performance application scenarios.
Process
5 nm
Cores
8
TDP
6 W
Memory Type
LPDDR5
Max bandwidth
44 Gbit/s
CPU
Architecture
1x 3.13 GHz – Cortex-A773x 2.54 GHz – Cortex-A774x 2.05 GHz – Cortex-A55
Frequency
3130 MHz
Cores
8
Instruction set
ARMv8.2-A
Process
5 nm
Transistor count
15.3
TDP
6 W
Manufacturing
TSMC
Graphics
GPU name
Mali-G78 MP24
GPU frequency
759 MHz
Execution units
24
Shading units
64
Vulkan version
1.3
OpenCL version
2.0
DirectX version
12
Memory
Memory Type
LPDDR5
Memory frequency
2750 MHz
Bus
4x 16 Bit
Max bandwidth
44 Gbit/s
Multimedia (ISP)
Neural processor (NPU)
AI accelerator
Storage type
UFS 3.1
Max display resolution
3840 x 2160
Video capture
4K at 60FPS
Video playback
4K at 60FPS
Video codecs
H.264, H.265, VP9
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
Connectivity
4G support
LTE Cat. 24
5G support
Yes
Download speed
Up to 4600 Mbps
Upload speed
Up to 2500 Mbps
Wi-Fi
6
Bluetooth
5.2
Navigation
GPS, GLONASS, Beidou, Galileo, NAVIC