Qualcomm Snapdragon X2 Plus (X2P 64 100) vs HiSilicon Kirin 659
SOC · Specs Compare
General Parameters
Release Date
Jan 2026
—
Manufacturer
Qualcomm
—
Type
Laptop
—
Instruction Set
ARMv9
—
Core Architecture
Snapdragon X
—
Processor Number
X2P-64-100
—
Integrated Graphics
Adreno X2-45
—
Package
Manufacturing Process
3 nm
—
Socket
Custom
—
CPU Performance
Performance Cores
10
—
Performance Core Threads
10
—
Performance Core Base Frequency
3.4 GHz
—
Performance Core Turbo Frequency
4.04 GHz
—
Total Core Count
10
—
Total Thread Count
10
—
Multiplier
34
—
L1 Cache
288 K per core
—
Unlocked Multiplier
No
—
Memory Parameters
Memory Types
LPDDR5X-9523
—
Max Memory Bandwidth
152 GB/s
—
ECC Memory Support
No
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Graphics Card Parameters
Integrated Graphics
true
—
GPU Base Frequency
500 MHz
—
GPU Max Dynamic Frequency
1700 MHz
—
Miscellaneous
CPU
Architecture
—
4x 2.36 GHz – Cortex-A534x 1.7 GHz – Cortex-A53
Frequency
—
2360 MHz
Cores
—
8
Instruction set
—
ARMv8-A
Process
—
16 nm
Transistor count
—
4
Graphics
GPU name
—
Mali-T830 MP2
GPU frequency
—
900 MHz
Execution units
—
2
Shading units
—
16
Vulkan version
—
1.0
OpenCL version
—
1.2
DirectX version
—
11
Memory
Memory Type
—
LPDDR3
Memory frequency
—
933 MHz
Bus
—
2x 32 Bit
Multimedia (ISP)
Neural processor (NPU)
—
No
Storage type
—
eMMC 5.1
Max display resolution
—
1920 x 1200
Max camera resolution
—
1x 16MP, 2x 8MP
Video capture
—
1K at 60FPS
Video playback
—
1080p at 60FPS
Video codecs
—
H.264, H.265
Audio codecs
—
AIFF, CAF, MP3, MP4, WAV
Connectivity
4G support
—
LTE Cat. 7
5G support
—
No
Download speed
—
Up to 300 Mbps
Upload speed
—
Up to 50 Mbps
Wi-Fi
—
4
Bluetooth
—
4.2
Navigation
—
GPS, GLONASS, Beidou
Info
Announced
—
Jan 2017
Class
—
Mid range
Model number
—
Hi6250
Benchmark
Geekbench 6
3,278
215
Geekbench 6
14,380
810
Cinebench 2024
120
—
Cinebench 2024
889
—
AnTuTu 10
—
103,952
FP32 (float)
—
57
▲ Specs Compare
Data sourced from official specifications and benchmark tests.