MediaTek Helio A25 vs Qualcomm Snapdragon X2 Plus (X2P 64 100)
SOC · Specs Compare
CPU
Architecture
4x 1.8 GHz – Cortex-A534x 1.5 GHz – Cortex-A53
—
Frequency
1800 MHz
—
Cores
8
—
Instruction set
ARMv8-A
—
Process
12 nm
—
TDP
5 W
—
Manufacturing
TSMC
—
Graphics
GPU name
PowerVR GE8320
—
GPU frequency
660 MHz
—
Execution units
4
—
Shading units
8
—
Vulkan version
1.1
—
OpenCL version
1.2
—
DirectX version
11
—
Memory
Memory Type
LPDDR4X
—
Memory frequency
1600 MHz
—
Bus
2x 16 Bit
—
Max bandwidth
13.9 Gbit/s
—
Multimedia (ISP)
Neural processor (NPU)
NeuroPilot
—
Storage type
eMMC 5.1
—
Max display resolution
1600 x 720
—
Max camera resolution
1x 16MP
—
Video capture
1K at 30FPS
—
Video playback
1080p at 30FPS
—
Video codecs
H.264, H.265
—
Audio codecs
AIFF, CAF, MP3, MP4, WAV
—
Connectivity
4G support
LTE Cat. 4
—
5G support
No
—
Download speed
Up to 150 Mbps
—
Upload speed
Up to 50 Mbps
—
Wi-Fi
5
—
Bluetooth
5.0
—
Navigation
GPS, GLONASS, Beidou
—
Info
Announced
Jun 2018
—
Class
Low end
—
Model number
MT6762V/WD
—
General Parameters
Release Date
—
Jan 2026
Manufacturer
—
Qualcomm
Type
—
Laptop
Instruction Set
—
ARMv9
Core Architecture
—
Snapdragon X
Processor Number
—
X2P-64-100
Integrated Graphics
—
Adreno X2-45
Package
Manufacturing Process
—
3 nm
Socket
—
Custom
CPU Performance
Performance Cores
—
10
Performance Core Threads
—
10
Performance Core Base Frequency
—
3.4 GHz
Performance Core Turbo Frequency
—
4.04 GHz
Total Core Count
—
10
Total Thread Count
—
10
Multiplier
—
34
L1 Cache
—
288 K per core
Unlocked Multiplier
—
No
Memory Parameters
Memory Types
—
LPDDR5X-9523
Max Memory Bandwidth
—
152 GB/s
ECC Memory Support
—
No
Graphics Card Parameters
Integrated Graphics
—
true
GPU Base Frequency
—
500 MHz
GPU Max Dynamic Frequency
—
1700 MHz
Miscellaneous
Benchmark
Geekbench 6
152
3,278
Geekbench 6
708
14,380
FP32 (float)
41
—
Cinebench 2024
—
120
Cinebench 2024
—
889
▲ Specs Compare
Data sourced from official specifications and benchmark tests.